CMP Equipment - List of Manufacturers, Suppliers, Companies and Products

CMP Equipment Product List

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φ300 compatible CMP device TCRM900

φ300 compatible CMP device TCRM900

This is a manual CMP device compatible with φ300 wafers. It is ideal for MEMS, TSV, and thin processing.

It is ideal for film processing (CMP) of silicon wafers and thin plate processing. There are devices compatible with Low-K films, conductive films, and insulating films. Thin plate processing of wafer materials can also be performed with a separate optional device, allowing for the separation of wafers as thin as 30μm and 50μm.

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Introduction to GNC pattern wafer services and other contract processing services.

Introduction to GNC pattern wafer services and other contract processing services.

We can provide consistent production from substrate arrangement to mask design! Introducing the contract processing services of Global Net Co., Ltd., including pattern wafer services!

At Global Net Co., Ltd., we provide services such as GNC processing foundry and GNC patterned wafer services. We mainly offer processing services for silicon wafers, glass, and other materials tailored to our customers' needs. We are capable of providing integrated production from substrate arrangement to mask design. 【Business Overview】 ■ GNC Processing Foundry - Film deposition foundry - Process evaluation ■ GNC Patterned Wafer Services - GNC fine patterned wafers - GNC advanced CMP evaluation patterned wafers - GNC MEMS and silicon special processing services ■ GNC 2.1D/2.5D/3D Solutions - Bump wafer and redistribution processing / FOWLP process services *For more details, please refer to the PDF materials or feel free to contact us.

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Fully Automatic CMP Device 'MGP-808XJ'

Fully Automatic CMP Device 'MGP-808XJ'

Dry in / dry out is possible! Equipment for mirror finishing of silicon wafers.

The "MGP-808XJ" is a fully automatic CMP device that is the successor to the Lap Master SFT's "LGP-808XJ." It adopts a newly developed head from our company, achieving improvements in GBIR and SFQR on the wafer surface. The transport method is either edge clamp or edge contact. Additionally, it allows for dry in/dry out capabilities through integration with a cleaning machine. 【Features】 ■ Successor model to the Lap Master SFT's "LGP-808XJ" ■ Achieves improvements in GBIR and SFQR on the wafer surface ■ High throughput with 8 polishing heads and 3 polishing plates ■ All transport systems utilize either edge clamp or edge contact methods ■ Allows for dry in/dry out capabilities through integration with a cleaning machine *For more details, please refer to the PDF document or feel free to contact us.

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